Capabilities at a Glance
Expertise High Density Complex Designs. Large Scale Digital Designs. Analog Low Noise Designs. High Speed Digital Designs. Backplanes, Passive and Active. Analog- and SMPS Power Supplies. MCM, Flip Chip and Chip on Board Hybrid Designs RF and Microwave Designs DUT Boards & Probe Cards
	Knowledge Complex Multi layer Structure. Blind, Buried and Micro Vias. Stripline and Micro Strip Z-Controlled Drill and Drill-back. Stub Reduction with Drill-back. (Counter boring) EMI / EMC Considerations. Matched / Controlled Delays. Propagation Delays Clock Timing SI Simulation. Termination Optimizing by Simulation Balanced Routing
Experience Space and Aerospace Miniature and Handheld. Medical Military Computers and Peripherals. Automotive. Data and Telecommunication. Radio and Television Satellite Communication.