Advanced High Tech PCB Design Solutions
Board Type Experiences High Density Complex Designs. Large Scale Digital Designs. Analog Low Noise Designs. High Speed Digital Designs. Backplanes, Passive and Active. Analog- and SMPS Power Supplies. MCM, Flip Chip and Chip on Board Hybrid Designs RF and Microwave Designs DUT Boards & Probe Cards	Intelligent path routing for maximum speed
Layout Technology Knowledge Complex Multilayer Structure. Rigid, Flex, Flex-Rigid Blind, Buried and Micro Vias. Stripline and Micro Strip Z-Controlled Drill and Drill-back. Stub Reduction with Drill-back. (Counter boring) EMI / EMC Considerations. Matched / Controlled Delays. Propagation Delays Clock Timing SI Simulation. Termination Optimizing by Simulation Balanced Routing	The PCB technology (stack up, via technology, laminate type) is basically pre-selected by the customer. But the final board technology is not determined before the design phase gets to the component placement. The key parameters are then determined in very close dialogue with the Customer, the PCB Fab House and the Assembly House.
Market Segments Space and Aerospace Miniature and Handheld. Medical and Military. Computers and Peripherals. Automotive. Data and Telecommunication. Radio and Television Satellite Communication.